TEC Temperature-Controlled Stage
High adjustment precision and excellent constant-temperature performance.; High heat-transfer efficiency and good temperature uniformity.; Compact, noise-free and vibration-free.; Both cooling and heating with a wide temperature control range.; Chip fixing by clamping or vacuum adsorption.
Product Introduction
The TEC temperature-controlled stage is a chip carrier built on semiconductor refrigeration technology that integrates precision temperature control and precision displacement adjustment. The carrier forms a multi-axis precision adjustment system using the company’s self-developed precision manual stages, embedded with a highly reliable semiconductor cooling chip and a copper or stainless-steel tabletop with excellent heat conduction. The tabletop has good temperature uniformity with a variation of no more than 0.2 °C, providing a stable and efficient constant-temperature environment for coupling, packaging and testing of optical, electrical and optoelectronic hybrid chips.
Product Features
High adjustment precision and excellent constant-temperature performance.; High heat-transfer efficiency and good temperature uniformity.; Compact, noise-free and vibration-free.; Both cooling and heating with a wide temperature control range.; Chip fixing by clamping or vacuum adsorption.
Technical Specifications
| Name | Model | Cooling Method | Adjustment Axes | Tabletop |
|---|---|---|---|---|
| TEC Temperature-Controlled Stage | FAT01 | Water Cooling | X, Y, R | Copper |
| Tabletop Size | 40mm×40mm | Tabletop Material | Copper |
|---|---|---|---|
| X-Axis Adjustment Range | ±6.5mm | X-Axis Minimum Scale | 10μm |
| Y-Axis Adjustment Range | ±6.5mm | Y-Axis Minimum Scale | 10μm |
| R-Axis Adjustment Range | Coarse 360°, fine 5° | R-Axis Minimum Scale | Coarse 1°, fine 5′ |
| Operating Temperature Range | -5℃~100℃ | Temperature Uniformity | ≤0.2℃ |
| TEC Cooling Method | Water Cooling | Chip Fixing Method | Vacuum Adsorption |
